By John H. Lau,Cheng Kuo Lee,C. S. Premachandran,Yu Aibin
A finished advisor to 3D MEMS packaging tools and solutions
Written through specialists within the box, Advanced MEMS Packaging serves as a invaluable reference for these confronted with the demanding situations created via the ever-increasing curiosity in MEMS units and packaging. This authoritative consultant offers state-of-the-art MEMS (microelectromechanical structures) packaging thoughts, reminiscent of low-temperature C2W and W2W bonding and 3D packaging.
This definitive source is helping you choose trustworthy, artistic, high-performance, powerful, and low-cost packaging ideas for MEMS units. The booklet also will reduction in stimulating extra examine and improvement in electric, optical, mechanical, and thermal designs in addition to fabrics, strategies, production, checking out, and reliability. one of the issues explored:
- Advanced IC and MEMS packaging trends
- MEMS units, advertisement purposes, and markets
- More than 360 MEMS packaging patents and 10 3D MEMS packaging designs
- TSV for 3D MEMS packaging
- MEMS wafer thinning, dicing, and handling
- Low-temperature C2C, C2W, and W2W bonding
- Reliability of RoHS-compliant MEMS packaging
- Micromachining and water bonding techniques
- Actuation mechanisms and built-in micromachining
- Bubble swap, optical swap, and VOA MEMS packaging
- Bolometer and accelerameter MEMS packaging
- Bio-MEMS and biosensor MEMS packaging
- RF MEMS switches, tunable circuits, and packaging
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Extra resources for Advanced MEMS Packaging
Advanced MEMS Packaging by John H. Lau,Cheng Kuo Lee,C. S. Premachandran,Yu Aibin